Electronic device
AssigneeLG Innotek Co., Ltd.
InventorsYong Seok CHO, Won Seok NAM, Jae Sam LEE, Yun Young JUNG
Life of this patent
Estimating the term…
Abstract
This electronic device comprises: a substrate including a hole; an electronic component disposed on one surface of the substrate; a heat emitting body disposed on the other surface of the substrate; and a heat transfer member disposed between the electronic component and the heat emitting body, wherein the hole includes a first region into which a portion of the heat transfer member is inserted and a second region having a smaller width than the first region.
Claims22
An electronic device comprising:
- a substrate including a hole;
- an electronic component disposed on one surface of the substrate;
- a heat emitting body disposed on an other surface of the substrate;
- and
- a heat transfer member disposed between the electronic component and the heat emitting body,
- wherein the hole includes a first region into which a portion of the heat transfer member is inserted and a second region having a smaller width than does the first region.
(canceled)
(canceled)
The portion is soldered is disposed on a surface of the substrate.
An electronic device comprising:
- a substrate including a hole;
- an electronic component disposed on one side of the substrate;
- a heat emitting body disposed on an other surface of the substrate;
- and
- a heat transfer member disposed between the electronic component and the heat emitting body,
- wherein the heat transfer member penetrates the substrate, and
- wherein one side surface of the heat transfer member is spaced apart from one side surface of the hole of the substrate in a first direction.
Dependencies are inferred from the claim text.