H05K 2201/10803
Tapered leads, i.e. leads having changing width or diameter
H05K2201/10803 (Tapered leads, i.e. leads having changing width or diameter) appears on 25 US grants and 34 published applications in this corpus.
Search patents in H05K- Granted patents
- 25
- Published applications
- 34
- Assignees
- 27
- Inventors
- 68
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 2 |
| 2009 | 2 | 1 |
| 2010 | 2 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 2 |
| 2015 | 1 | 3 |
| 2016 | 2 | 1 |
| 2017 | 3 | 7 |
| 2018 | 3 | 2 |
| 2019 | 1 | 1 |
| 2020 | 2 | 2 |
| 2021 | 1 | 1 |
| 2022 | 2 | 3 |
| 2023 | 2 | 2 |
| 2024 | 1 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Flexible printed circuit board, in particular for connecting electrical and/or electronic components14 Apr 2026US 12,604,411 B2Robert Bosch GmbH
- Assembly having a solder pin and a solder point17 Dec 2024US 12,170,431 B2Phoenix Contact GmbH & Co.KG
- Flexible electronic structure and method for producing same7 Nov 2023US 11,812,559 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Component mounted on circuit board29 Aug 2023US 11,744,019 B2Murata Manufacturing Co., Ltd.
- Methods of making printed structures27 Dec 2022US 11,540,398 B2X Display Company Technology Limited
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Flexible printed circuit board, in particular for connecting electrical and/or electronic components8 Aug 2024US 2024/0268033 A1Robert Bosch GmbH
- Inductor Mountable on a Circuit Board17 Aug 2023US 2023/0260690 A1ABB Schweiz AG
- Methods of making printed structures23 Mar 2023US 2023/0091571 A1X Display Company Technology Limited
- Assembly having a solder pin and a solder point28 Jul 2022US 2022/0239047 A1Phoenix Contact GmbH & Co.KG
Most cited
By later US patents
- Shield can having tapered wall ends for surface mounting and radiotelephones incorporating same14US 6,175,077 B1Ericsson Inc. · 2001
- Electronic device12US 7,563,112 B2Denso Corporation · 2009
- Radio frequency connector and assembly having micro-via radial interconnect8US 9,761,972 B2Mercury Systems, Inc. · 2017
- Soldered interconnect for a printed circuit board having an angular radial feature7US 10,096,915 B2Mercury Systems, Inc. · 2018
- Electronic device and manufacturing method of the same5US 7,677,905 B2Denso Corporation · 2010