Electronic device and manufacturing method of the same
AssigneeDenso Corporation
InventorTakayoshi Honda
Life of this patent
Estimating the term…
Abstract
An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.
Claims34
An electronic device comprising:
- a printed circuit board having a first side and a second side;
- and
- an electronic element having a body and a plurality of terminals, wherein the plurality of terminals is aligned along with an alignment direction,
- the electronic element is disposed on the first side of the printed circuit board,
- the printed circuit board further includes a plurality of through holes and a plurality of lands,
- each through hole penetrates the printed circuit board from the first side to the second side,
- each terminal is coupled with a corresponding land through a solder,
- the plurality of lands includes at least one surface land disposed on the first side and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole,
- the plurality of terminals includes a branch terminal having an insertion member and a surface member,
- the insertion member is inserted in the through hole in such a manner that the insertion member is coupled with the insertion land through the solder, which is supplied from the first side,
- the surface member is coupled with the surface land through the solder,
- the surface member is substantially parallel to a surface of the printed circuit board,
- the insertion member is perpendicular to the surface of the printed circuit board, and
- the insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole, wherein
- the insertion member and the surface member provide a T-shape, and
- the branch terminal is a stamped terminal.
A method for manufacturing an electronic device having a printed circuit board and an electronic element, the method comprising:
- preparing the printed circuit board having a first side and a second side, wherein the preparing the printed circuit board includes:
- forming a through hole in the printed circuit board to penetrate the printed circuit board from the first side to the second side;
- forming a surface land on the first side;
- and
- forming an insertion land on a sidewall of the through hole and on a periphery around the through hole;
- preparing the electronic element having a body and a plurality of terminals, wherein the preparing the electronic element includes:
- forming a branch terminal as one of the terminals on the electronic element;
- forming an insertion member in the branch terminal, the insertion member being to be inserted in the through hole and to be coupled with the insertion land;
- and
- forming a surface member in the branch terminal, the surface member being to be disposed on the surface land and to be coupled with the surface land;
- applying a solder, which includes:
- forming a solder on the surface land by a screen printing method;
- and
- inserting the solder in the through hole from the first side by the screen printing method so that the solder is formed on at least a part of the insertion land;
- and
- reflowing the solder, which includes:
- arranging the electronic element on the first side;
- inserting the insertion member in the through hole from the first side;
- and
- heating the solder to melt the solder so that the surface member is bonded to the surface land with the solder and the insertion member is bonded to the insertion land with the solder, wherein
- the insertion member and the surface member are formed so as to provide a T-shape, and
- the branch terminal is formed as a stamped terminal.
Dependencies are inferred from the claim text.