H05K 2201/10848
Thinned leads
H05K2201/10848 (Thinned leads) appears on 38 US grants and 26 published applications in this corpus.
Search patents in H05K- Granted patents
- 38
- Published applications
- 26
- Assignees
- 27
- Inventors
- 73
- Latest grant
- 11 Jul 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 2 |
| 2005 | 1 | 2 |
| 2006 | 0 | 2 |
| 2007 | 3 | 2 |
| 2008 | 1 | 1 |
| 2009 | 1 | 7 |
| 2010 | 4 | 0 |
| 2011 | 3 | 4 |
| 2012 | 2 | 0 |
| 2013 | 1 | 2 |
| 2014 | 0 | 2 |
| 2015 | 0 | 1 |
| 2016 | 2 | 0 |
| 2017 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Electronic module produced by sequential fixation of the components11 Jul 2017US 9,706,694 B2Valeo Systemes de Controle Moteur
- Solder spacer and electronic module comprising such a spacer18 Apr 2017US 9,629,245 B2Sagemcom Broadband SAS
- Electronic part and electronic control unit3 May 2016US 9,332,645 B2Denso Corporation
- Method and apparatus for converting commerical off-the-shelf (COTS) thin small-outline package (TSOP) components into rugged off-the-shelf (ROTS) components19 Apr 2016US 9,318,350 B2General Dynamics Advanced Information Systems, Inc.
- Method for producing an electronic module by means of sequential fixation of the components, and corresponding production line25 Jun 2013US 8,468,691 B2Valeo Systemes de Controle Moteur
- Solder spacer and electronic module comprising such a spacer18 Jun 2015US 2015/0173192 A1Sagemcom Broadband SAS
- Electronic part and electronic control unit28 Aug 2014US 2014/0240885 A1Denso Corporation
- Method and Apparatus for Converting Commerical Off-The-Shelf (COTS) Thin Small-Outline Package (TSOP) Components Into Rugged Off-The-Shelf (ROTS) Components15 May 2014US 2014/0131307 A1General Dynamics Advanced Information Systems, Inc.
- Method for producing an electronic module by means of sequential fixation of the components, and corresponding production line14 Nov 2013US 2013/0301231 A1Valeo Systemes de Controle Moteur
- Method for producing an electronic module by sequential fixation of the components13 Jun 2013US 2013/0148320 A1
Most cited
By later US patents
- Microbump interconnect for bore semiconductor dice148US 5,808,360 AMicron Technology, Inc. · 1998
- Method for fabricating microbump interconnect for bare semiconductor dice79US 5,834,366 AMicron Technology, Inc. · 1998
- Shunt connection to a PCB of an energy management system employed in an automotive vehicle78US 7,319,304 B2Midtronics, Inc. · 2008
- Electronic parts loaded module including thermal stress absorbing projecting electrodes40US 5,422,516 AHitachi, Ltd. · 1995
- Surface mount stress relief interface system and method32US 5,369,551 ASawtek, Inc. · 1994