Method for producing an electronic module by means of sequential fixation of the components, and corresponding production line
AssigneeValeo Systemes de Controle Moteur
InventorsBruno Lefevre, Christian Schwartz, Jean-Yves Moreno
Life of this patent
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Abstract
A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type component, wherein the production line includes a unit for putting the first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the second-type component in place, and a local heating unit for melting a solder placed between the at least one second-type component and the circuit.
Claims5
-8. (canceled)
A production line for producing electronic modules comprising:
- a printed-circuit board;
- at least one first-type component;
- and
- at least one second-type component,
- wherein the line comprises a unit for putting the at least one first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the at least one second-type component in place and a local heating unit for melting a solder placed between the at least one second-type component and the circuit.
An electronic module, comprising:
- a printed-circuit board;
- at least one first-type component soldered to the board in a first position;
- at least one second-type component in a second position, such that the second-type component has leads bearing on the board via a solder, the second-type component being soldered to the board by heating the solder locally,
- wherein the second-type component has been soldered to the board by applying two electrodes on each lead of the second-type component, each of the two electrodes directly contacting each leads of the second-type component, and by making an electrical current flow between the electrodes via the corresponding lead in order to heat each lead of the second-type component.
Dependencies are inferred from the claim text.