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US 2013/0148320 A1Published application
Method for producing an electronic module by sequential fixation of the components
OwnerBruno Lefevre, Jean-Yves Moreno +1inventors
InventorsBruno Lefevre, Jean-Yves Moreno, Christian Schwartz
Life of this patent
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Abstract
An electronic module includes a board with a printed circuit, at least one component of a first type soldered to the board, and at least one component of a second type. The component of the second type extends above the at least one component of the first type. The at least one component of the first type is placed at least partially between the at least one component of the second type and the board and the at least one component of the second type includes a plurality of pads soldered to the board.
Claims3
-8. (canceled)
An electronic module comprising:
- a board with a printed circuit,
- at least one component of a first type soldered to the board, and
- at least one component of a second type extending above the at least one component of the first type, the at least one component of the first type being placed at least partially between the at least one component of the second type and the board, and the at least one component of the second type having a plurality of pads soldered to the board.
Dependencies are inferred from the claim text.