Method and apparatus for converting commerical off-the-shelf (COTS) thin small-outline package (TSOP) components into rugged off-the-shelf (ROTS) components
AssigneeGeneral Dynamics Advanced Information Systems, Inc.
InventorsDeepak Keshav Pai, Melvin Eric Graf
Life of this patent
Estimating the term…
Abstract
An embodiment of the invention generally relates to a method of converting a commercial off-the-shelf electrical lead to a rugged off-the-shelf electrical lead by laser machining a portion of the electrical lead. The method includes ablating material from the electrical lead of the commercial off-the-shelf component to reduce the moment of inertia or increase the flexibility of the electrical lead.
Claims29
A method for modifying a lead of a Thin Small-Outline Package (TSOP) circuit, the method comprising:
- directing at least one laser source onto a target area located on the lead of the TSOP circuit;
- generating a laser beam from the at least one laser source such that the laser beam is incident on the target area of the lead of the TSOP circuit;
- and
- ablating material in the target area so that a moment of inertia of the lead of the TSOP circuit is reduced by a predetermined amount.
A method for modifying a lead of an integrated circuit, the method comprising the steps of:
- directing at least one laser source onto a target area located on the lead;
- generating a laser beam from the at least one laser source such that the laser beam is incident on the target area of the lead;
- introducing, prior to said generating, an energy-absorbing substance adjacent the target area to absorb energy from at least one of the laser beam or the lead;
- and
- ablating material in the target area so that a moment of inertia of the lead is reduced by a predetermined amount.
A method for modifying a lead of an integrated circuit, the method comprising the steps of:
- directing at least one laser source onto a target area located on the lead;
- generating a laser beam from the at least one laser source such that the laser beam is incident on the target area of the lead;
- and
- ablating material in the target area so that a moment of inertia of the lead is reduced by a predetermined amount;
- wherein the step of ablating material reduces a height of the lead in the target area to between about 0.003 to 0.004 inch.
A method for modifying a stiff lead of an integrated circuit, the method comprising the steps of:
- directing at least one laser source onto a target area located on the stiff lead;
- generating a laser beam from the at least one laser source such that the laser beam is incident on the target area of the stiff lead;
- and
- ablating stiff material of the lead in the target area so that a moment of inertia of the stiff lead is reduced by a predetermined amount, wherein the step of ablating material reduces a width of the stiff lead in the target area to between about 0.006 to 0.008 inch.
Dependencies are inferred from the claim text.