Electronic module produced by sequential fixation of the components
AssigneeValeo Systemes de Controle Moteur
InventorsBruno Lefevre, Christian Schwartz, Jean-Yves Moreno
Life of this patent
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Abstract
A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type component, wherein the production line includes a unit for putting the first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the second-type component in place, and a local heating unit for melting a solder placed between the at least one second-type component and the circuit.
Claims3
A production line for producing electronic modules, comprising:
- a printed-circuit board;
- at least one first-type component;
- and
- at least one second-type component,
- wherein the line comprises a first placement unit for putting the at least one first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the printed-circuit board, a second placement unit for putting the at least one second-type components in place and a local heating unit for melting a solder placed between the at least one second-type component and the printed-circuit board, and
- wherein the local heating unit comprises a pair of electrodes,
- wherein each electrode of the pair of electrodes is configured to contact a lead of the second-type component so as to make an electrical current flow between the pair of electrodes via the lead of the second-type component for heating each lead of the component sufficiently in order to melt the solder located between the lead and the printed-circuit board,
- wherein temperature of the electrodes is kept substantially constant and at approximately a low temperature of 40° C., and
- wherein a power supply is operatively connected to the pair of electrodes such that the electrical current flows between the electrodes to heat the lead of the second-type component, the electrical current having a current intensity curve as a function of time that comprises a minimum frequency of 1,000 Hz.
A production line for producing electronic modules, comprising:
- a printed-circuit board;
- at least one first-type component;
- and
- at least one second-type component,
- wherein the line comprises a first placement unit for putting the at least one first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the printed-circuit board, a second placement unit for putting the at least one second-type components in place and a local heating unit for melting a solder placed between the at least one second-type component and the printed-circuit board, and
- wherein the local heating unit comprises a pair of electrodes,
- wherein each electrode of the pair of electrodes is configured to contact a lead of the second-type component so as to make an electrical current flow between the pair of electrodes via the lead of the second-type component,
- wherein temperature of the electrodes is kept substantially constant and at approximately a low temperature of 40° C.,
- wherein a power supply is operatively connected to the pair of electrodes such that the electrical current flows between the electrodes to heat the lead of the second-type component sufficiently to melt the solder located between the lead and the printed-circuit board, and
- wherein each electrode of the pair of electrodes is configured to contact the lead by contacting a flat surface of the lead, the flat surface being opposite to the printed-circuit board.
Dependencies are inferred from the claim text.