H05K 2201/10886
Other details
H05K2201/10886 (Other details) appears on 712 US grants and 479 published applications in this corpus.
Search patents in H05K- Granted patents
- 712
- Published applications
- 479
- Assignees
- 365
- Inventors
- 1,460
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 8 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 6 | 0 |
| 1986 | 11 | 0 |
| 1987 | 14 | 0 |
| 1988 | 13 | 0 |
| 1989 | 14 | 0 |
| 1990 | 8 | 0 |
| 1991 | 24 | 0 |
| 1992 | 23 | 0 |
| 1993 | 12 | 0 |
| 1994 | 18 | 0 |
| 1995 | 17 | 0 |
| 1996 | 15 | 0 |
| 1997 | 14 | 0 |
| 1998 | 18 | 0 |
| 1999 | 25 | 0 |
| 2000 | 18 | 0 |
| 2001 | 18 | 13 |
| 2002 | 21 | 20 |
| 2003 | 14 | 12 |
| 2004 | 12 | 21 |
| 2005 | 23 | 35 |
| 2006 | 17 | 22 |
| 2007 | 24 | 30 |
| 2008 | 12 | 37 |
| 2009 | 28 | 25 |
| 2010 | 26 | 22 |
| 2011 | 14 | 15 |
| 2012 | 14 | 15 |
| 2013 | 13 | 13 |
| 2014 | 11 | 14 |
| 2015 | 12 | 18 |
| 2016 | 12 | 16 |
| 2017 | 22 | 13 |
| 2018 | 16 | 16 |
| 2019 | 13 | 13 |
| 2020 | 18 | 14 |
| 2021 | 8 | 17 |
| 2022 | 9 | 17 |
| 2023 | 24 | 22 |
| 2024 | 13 | 18 |
| 2025 | 18 | 15 |
| 2026 | 12 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/10946Leads attached onto leadless component after manufacturing the componentIndexing code234
- H05K 2201/10909Materials of terminalIndexing code204
- H05K 2201/10924Leads formed from a punched metal foilIndexing code183
- H05K 2201/10916Terminals having auxiliary metallic pieceIndexing code69
- H05K 2201/10901Lead partly inserted in hole or viaIndexing code40
- H05K 2201/10931Exposed leads, i.e. encapsulation of component partly removed for exposing a partIndexing code36
- H05K 2201/10893Grouped leads, i.e. element comprising multiple leads distributed around but not throughIndexing code29
- H05K 2201/10939Lead of component used as a connectorIndexing code20
Recent patents
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Electrical component and method of forming same4 Aug 2026US 12,701,657 B2Medtronic, Inc.
- Flexible printed circuit board, wiring module, flexible printed circuit board including terminal, and power storage module30 Jun 2026US 12,672,241 B2Autonetworks Technologies, Ltd.
- Leadframe mounting with lead insertion for lead wall bonding9 Jun 2026US 12,652,759 B2Semiconductor Components Industries, LLC
- Electronic device26 May 2026US 12,641,710 B2Advanced Semiconductor Engineering, Inc.
- Leadframe mounting with lead insertion for lead wall bonding17 Sep 2026US 2026/0282230 A1Semiconductor Components Industries, LLC
- Power semiconductor module for a traction converter11 Jun 2026US 2026/0163564 A1ZF Friedrichshafen AG
- Flexible printed circuit board assembly, battery module including the same and method of manufacturing the flexible printed circuit board assembly16 Apr 2026US 2026/0107376 A1Samsung SDI.Co., Ltd.
- Semiconductor package with guide pin16 Apr 2026US 2026/0107853 A1Semiconductor Components Industries, LLC
- Semiconductor device and method for manufacturing the same19 Mar 2026US 2026/0082946 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999