H05K 2201/10893
Grouped leads, i.e. element comprising multiple leads distributed around but not through
Official title: Grouped leads, i.e. element comprising multiple leads distributed around but not through a common insulator
H05K2201/10893 (Grouped leads, i.e. element comprising multiple leads distributed around but not through) appears on 29 US grants and 22 published applications in this corpus.
Search patents in H05K- Granted patents
- 29
- Published applications
- 22
- Assignees
- 19
- Inventors
- 68
- Latest grant
- 30 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 1 |
| 2003 | 2 | 2 |
| 2004 | 0 | 2 |
| 2005 | 3 | 4 |
| 2006 | 1 | 1 |
| 2007 | 2 | 1 |
| 2008 | 0 | 1 |
| 2009 | 1 | 1 |
| 2010 | 4 | 1 |
| 2011 | 0 | 3 |
| 2012 | 1 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Flip-chip bonding structure and circuit board thereof30 Sep 2025US 12,432,849 B2Chipbond Technology Corporation
- Insertable stubless interconnect29 Jun 2021US 11,050,172 B2International Business Machines Corporation
- Methods for manufacturing a Z-directed printed circuit board component having a removable end portion7 Nov 2017US 9,814,145 B2Lexmark International, Inc.
- Semiconductor device with high density optical chips and manufacturing method thereof13 Aug 2013US 8,507,927 B2Kabushiki Kaisha Toshiba
- Z-directed connector components for printed circuit boards25 Sep 2012US 8,273,996 B2Lexmark International, Inc.
- Flip-chip bonding structure and circuit board thereof25 Dec 2025US 2025/0393118 A1Chipbond Technology Corporation
- Flip-chip bonding structure and circuit board thereof23 Nov 2023US 2023/0380053 A1Chipbond Technology Corporation
- Insertable stubless interconnect27 May 2021US 2021/0159622 A1International Business Machines Corporation
- Methods for Manufacturing a Z-Directed Printed Circuit Board Component Having a Removable End Portion18 Jun 2015US 2015/0173207 A1Lexmark International, Inc.
- Z-directed printed circuit board components having a removable end portion and methods therefor26 Dec 2013US 2013/0341078 A1
Most cited
By later US patents
- Multi-connection via with electrically isolated segments154US 6,388,208 B1Teradyne, Inc. · 2002
- Leadless high density connector92US 5,593,322 ADell USA, L. P. · 1997
- Apparatus having inner layers supporting surface-mount components86US 5,543,586 AThe Panda Project · 1996
- Split via surface mount connector and related techniques72US 6,137,064 ATeradyne, Inc. · 2000
- Electronic component package with multiconductive base forms for multichannel mounting53US 4,654,472 A1987