Leadless high density connector

A high density connector, comprising:

• a connector body having top and bottom surfaces including a plurality of sockets formed along said top surface and penetrating within said connector body, said sockets including socket walls;
• a plurality of independent conductive traces brazed along said socket walls of each of said plurality of sockets;
• a plurality of solder balls forming a ball grid array on said bottom surface of said connector body;
• and
• a plurality of conductors for electrically coupling each of said plurality of conductive traces to corresponding ones of said plurality of solder balls.

A printed wiring board having a surface, comprising:

• an array of conductive pads mounted along the surface of the printed wiring board;
• a high density connector implemented with a ball grid array for interconnecting said connector to said array of conductive pads attached to the printed wiring board using surface mount technology, said connector comprising:
• a connector body having top and bottom surfaces including a plurality of non-conductive connector pins integrally mounted on a top surface of said connector;
• a plurality of conductive traces brazed on each of said plurality of connector pins;
• a plurality of conductive vias for electrically coupling each of said plurality of conductive traces to corresponding ones of said arrays of conductive pads;
• and
• a plurality of reflowed solder pads for electrically interconnecting and mechanically attaching said conductive vias to corresponding ones of said array of conductive pads.