Flip-chip bonding structure and circuit board thereof
AssigneeChipbond Technology Corporation
InventorsChun-Te Lee, Chih-Ming Peng, Pi-Yu Peng, Hui-Yu Huang
Life of this patent
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Abstract
A flip-chip bonding structure includes a chip and a circuit board, the chip is bonded to the circuit board by bumps. The circuit board includes a light-transmissive substrate, a first circuit group, a second circuit group, a boundary circuit and an identifying member. The boundary circuit is located between the first and second circuit groups and projects a boundary circuit shadow on light-transmissive substrate. The boundary circuit shadow can be recognized according to the identifying member and is provided to identify the boundary between the first and second circuit groups or identify the position of leads with the smallest pitch.
Claims10
A flip-chip bonding structure comprising:
- a chip including a plurality of first bumps and a plurality of second bumps;
- and
- a circuit board including:
- a light-transmissive substrate including a first surface and a second surface;
- a first circuit group disposed on the first surface and including a plurality of first leads, each of the plurality of first leads includes a first bonding portion and projects a first lead shadow on the second surface, there is a first gap between the adjacent first leads, each of the plurality of first bumps is configured to be bonded to the first bonding portion of one of the plurality of first leads and projects a first bump shadow on the second surface;
- a second circuit group disposed on the first surface and including a plurality of second leads, each of the plurality of second leads includes a second bonding portion and projects a second lead shadow on the second surface, there is a second gap between the adjacent second leads, the second gap is not equal to the first gap, each of the plurality of second bumps is configured to be bonded to the second bonding portion of one of the plurality of second leads and projects a second bump shadow on the second surface;
- a boundary circuit disposed on the first surface and located between the first and second circuit groups, the boundary circuit projects a boundary circuit shadow on the second surface;
- and
- an identifying member located on the second surface, wherein the boundary circuit shadow and the identifying member are configured to be passed through by a vertical imaginary line.
Dependencies are inferred from the claim text.