Electronic component package with multiconductive base forms for multichannel mounting

Abstract

An improved electronic component or integrated circuit (IC) package characterized by an extraordinary small size for the number of input-output (I/O) leads which are available and capable of use on surface mounted, Flat Pack, hybrid, or through hole (DIP) printed circuit boards. The package has one or more cylindrical or shaped forms at the base, with a flange to provide a stop in order to limit the insertion travel in those circuit boards having through holes, and a top body which is used to house the electronic device. The forms, which protrude down from the upper body (housing), have one or more conductive lead segments, either pins or printed circuit types, running longitudinally and continuing through the housing to the upper body. Each lead segment is connected directly to the electronic device or attached via an additonal lead to a pad on the electronic device, mounted on the upper body. A cover to seal the device is provided. Grooves in the body or on the cover aid in handling the device, either manually or by automatic machinery, are provided. These grooves also provide gripping areas for top hat heat sinks.

Dependencies are inferred from the claim text.