H05K 2201/10901
Lead partly inserted in hole or via
H05K2201/10901 (Lead partly inserted in hole or via) appears on 40 US grants and 48 published applications in this corpus.
Search patents in H05K- Granted patents
- 40
- Published applications
- 48
- Assignees
- 45
- Inventors
- 126
- Latest grant
- 27 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 0 | 0 |
| 2005 | 2 | 2 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 3 |
| 2009 | 1 | 1 |
| 2010 | 2 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 3 |
| 2016 | 0 | 4 |
| 2017 | 2 | 4 |
| 2018 | 4 | 5 |
| 2019 | 4 | 1 |
| 2020 | 1 | 5 |
| 2021 | 3 | 3 |
| 2022 | 2 | 2 |
| 2023 | 7 | 7 |
| 2024 | 4 | 4 |
| 2025 | 4 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrical connector with integrated electrostatic discharge protection27 Jan 2026US 12,537,343 B2Rockwell Collins, Inc.
- Power semiconductor device30 Dec 2025US 12,513,826 B2Hitachi Astemo, Ltd.
- Semiconductor package comprising a cavity with exposed contacts and a semiconductor module23 Dec 2025US 12,506,051 B2Infineon Technologies Austria AG
- Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole1 Jul 2025US 12,349,287 B2Pac Tech—Packaging Technologies GmbH
- Substrate module and power module for transformer29 Apr 2025US 12,289,835 B2LG Innotek Co., Ltd.
- Via assembly for printed circuit board4 Sep 2025US 2025/0280496 A1Cisco Technology, Inc.
- Electrical connector with integrated electrostatic discharge protection1 May 2025US 2025/0141157 A1Rockwell Collins, Inc.
- Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole7 Nov 2024US 2024/0373563 A1Pac Tech—Packaging Technologies GmbH
- Transistor pin alignment assembly27 Jun 2024US 2024/0215167 A1Garrett Transportation I Inc.
- Inverter module14 Mar 2024US 2024/0090114 A1Ls Electric Co., Ltd.
Most cited
By later US patents
- Printed circuit board with through-hole connection42US 4,787,853 AKabushiki Kaisha Toshiba · 1988
- Electronic device12US 7,563,112 B2Denso Corporation · 2009
- Radio frequency connector and assembly having micro-via radial interconnect8US 9,761,972 B2Mercury Systems, Inc. · 2017
- Soldered interconnect for a printed circuit board having an angular radial feature7US 10,096,915 B2Mercury Systems, Inc. · 2018
- Systems and methods for providing a high speed interconnect system with reduced crosstalk7US 10,517,167 B1Eagle Technology, LLC · 2019