Via assembly for printed circuit board

A method comprising:

• forming adjacent pairs of signal vias through a layer of a printed circuit board;
• forming a first plurality of ground vias through the layer of the printed circuit board to at least partially circumferentially surround a first signal via of a first pair of signal vias of the adjacent pairs of signal vias;
• and
• forming a second plurality of ground vias through the layer of the printed circuit board to at least partially circumferentially surround a second signal via of a second pair of signal vias of the adjacent pairs of signal vias, wherein the first plurality of ground vias and the second plurality of ground vias comprise a common ground via.

An apparatus comprising:

• a first pair of signal vias of a printed circuit board, wherein the first pair of signal vias are configured to propagate respective signals;
• a second pair of signal vias of the printed circuit board, wherein the second pair of signal vias are configured to propagate respective signals, and the signal vias of the first pair of signal vias and the second pair of signal vias are offset from one another along a first axis and aligned with one another along a second axis that is perpendicular to the first axis;
• and
• a single ground via positioned between the first pair of signal vias and the second pair of signal vias along the first axis.