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US 12,506,051 B2Granted
Semiconductor package comprising a cavity with exposed contacts and a semiconductor module
AssigneeInfineon Technologies Austria AG
InventorsJulian Treu, Ivan Nikitin, Bernd Schmoelzer
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Abstract
A semiconductor package comprising a substrate, at least one semiconductor die disposed on the substrate, at least one electrical connector connected with the semiconductor die, an encapsulant covering the substrate, the at least one semiconductor die, and at least partially the electrical connector, the encapsulant comprising a recess formed into a main surface of the encapsulant, wherein the at least one electrical connector is exposed within the recess.
Claims16
A semiconductor package, comprising
- a substrate;
- at least one semiconductor die disposed on the substrate;
- at least one electrical connector connected with the semiconductor die;
- an encapsulant covering the substrate, the at least one semiconductor die, and at least partially the electrical connector, the encapsulant comprising a recess formed into a main surface of the encapsulant;
- wherein the electrical connector is one of a wire, a ribbon or a clip,
- wherein the recess comprises a bottom surface formed by the encapsulant,
- wherein the at least one electrical connector is exposed within the recess such that the electrical connector protrudes out from the bottom surface of the recess that is formed by the encapsulant.
4 more elements
A semiconductor module comprising
- a semiconductor package, comprising
- a substrate;
- at least one semiconductor die disposed on the substrate, the semiconductor die comprising at least one electrical connector;
- an encapsulant covering the substrate, the at least one semiconductor die, and at least partially the electrical connector, the encapsulant comprising a recess formed into a main surface of the encapsulant;
- wherein the electrical connector is one of a wire, a ribbon or a clip,
- wherein the recess comprises a bottom surface formed by the encapsulant,
- wherein the at least one electrical connector is exposed within the recess such that the at least one electrical connector protrudes out from the bottom surface of the recess that is formed by the encapsulant;
- and
- a printed circuit board disposed in or on the recess, the printed circuit board comprising a semiconductor driver die disposed thereon, the semiconductor driver die being electrically connected with the at least one electrical connector.
6 more elements
Dependencies are inferred from the claim text.