Systems and methods for providing a high speed interconnect system with reduced crosstalk

A system, comprising:

• a Printed Wiring Board (“PWB”) comprising:
• a core substrate comprising a plurality of laminated dielectric substrate layers with a first via formed therethrough,
• a first trace disposed on an exposed surface of the core substrate that is in electrical contact with the first via,
• a first High Density Interconnect (“HDI”) substrate laminated to the core substrate such that the first trace electrically connects the first via with a second via formed through the first HDI substrate,
• a second trace disposed on an exposed surface of the first HDI substrate that is in electrical contact with the second via, and
• a second HDI substrate laminated to the first HDI substrate such that the second trace electrically connects the second via to a third via formed through the second HDI substrate;
• wherein the second via comprises a buried via with a central axis spatially offset from central axis of the first and third vias, and the first and second vias having diameters which are smaller than a diameter of the third via.