H05K 2201/10909
Materials of terminal
Official title: Materials of terminal, e.g. of leads or electrodes of components
H05K2201/10909 (Materials of terminal) appears on 204 US grants and 140 published applications in this corpus.
Search patents in H05K- Granted patents
- 204
- Published applications
- 140
- Assignees
- 110
- Inventors
- 347
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 7 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 6 | 0 |
| 1999 | 10 | 0 |
| 2000 | 7 | 0 |
| 2001 | 11 | 8 |
| 2002 | 9 | 15 |
| 2003 | 6 | 5 |
| 2004 | 8 | 8 |
| 2005 | 10 | 10 |
| 2006 | 11 | 12 |
| 2007 | 9 | 17 |
| 2008 | 6 | 11 |
| 2009 | 12 | 6 |
| 2010 | 7 | 6 |
| 2011 | 6 | 3 |
| 2012 | 3 | 4 |
| 2013 | 6 | 3 |
| 2014 | 2 | 1 |
| 2015 | 4 | 2 |
| 2016 | 2 | 4 |
| 2017 | 4 | 3 |
| 2018 | 4 | 3 |
| 2019 | 3 | 2 |
| 2020 | 0 | 2 |
| 2021 | 1 | 1 |
| 2022 | 3 | 3 |
| 2023 | 2 | 0 |
| 2024 | 0 | 3 |
| 2025 | 4 | 7 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Power semiconductor module for a traction converter11 Jun 2026US 2026/0163564 A1ZF Friedrichshafen AG
- Semiconductor device and manufacturing method of semiconductor device14 Aug 2025US 2025/0261313 A1Kabushiki Kaisha Toshiba
- Circuit board and method for manufacturing mounting board22 May 2025US 2025/0168986 A1TDK Corporation
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- Stretchable device13 Mar 2025US 2025/0089159 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002