H05K 2201/10946
Leads attached onto leadless component after manufacturing the component
H05K2201/10946 (Leads attached onto leadless component after manufacturing the component) appears on 234 US grants and 133 published applications in this corpus.
Search patents in H05K- Granted patents
- 234
- Published applications
- 133
- Assignees
- 107
- Inventors
- 357
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 10 | 0 |
| 1988 | 8 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 5 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 6 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 11 | 0 |
| 2000 | 9 | 0 |
| 2001 | 10 | 8 |
| 2002 | 7 | 7 |
| 2003 | 7 | 4 |
| 2004 | 7 | 8 |
| 2005 | 6 | 4 |
| 2006 | 7 | 4 |
| 2007 | 5 | 9 |
| 2008 | 2 | 11 |
| 2009 | 8 | 7 |
| 2010 | 7 | 9 |
| 2011 | 5 | 2 |
| 2012 | 4 | 2 |
| 2013 | 4 | 2 |
| 2014 | 3 | 9 |
| 2015 | 3 | 3 |
| 2016 | 4 | 7 |
| 2017 | 9 | 3 |
| 2018 | 3 | 4 |
| 2019 | 3 | 8 |
| 2020 | 12 | 2 |
| 2021 | 1 | 6 |
| 2022 | 2 | 4 |
| 2023 | 5 | 1 |
| 2024 | 1 | 7 |
| 2025 | 3 | 1 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Leadframe mounting with lead insertion for lead wall bonding9 Jun 2026US 12,652,759 B2Semiconductor Components Industries, LLC
- Electronic component27 Jan 2026US 12,537,133 B2Samsung Electro-Mechanics Co., Ltd.
- Power semiconductor device30 Dec 2025US 12,513,826 B2Hitachi Astemo, Ltd.
- Method for forming power module package, power module package and electronic device12 Aug 2025US 12,389,553 B2Delta Electronics, Inc.
- Leadframe mounting with lead insertion for lead wall bonding17 Sep 2026US 2026/0282230 A1Semiconductor Components Industries, LLC
- Optical module packaging structure and method of manufacturing the same20 Feb 2025US 2025/0062592 A1Primax Electronics Ltd.
- Printed Circuit Board, Manufacturing Method Thereof, and Battery Pack Including the Same28 Nov 2024US 2024/0397616 A1LG Energy Solution, Ltd.
- Electronic component12 Sep 2024US 2024/0304382 A1Samsung Electro-Mechanics Co., Ltd.
- Motor and control device15 Aug 2024US 2024/0275230 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002