Optical module packaging structure and method of manufacturing the same

Abstract

An optical module packaging structure is provided, which includes a circuit board, an electronic component, a lead frame and a light emitting module. The electronic component is disposed on the circuit board. The lead frame is disposed on the electronic component, in which the lead frame has a first connection portion electrically connected to the circuit board. The light emitting module is disposed on the lead frame, in which the light emitting module includes a first connection pad located at a bottom of the light emitting module, and the first connection pad is electrically connected to the circuit board through the first connection portion of the lead frame. A method of manufacturing the aforementioned optical module packaging structure is also provided.

Dependencies are inferred from the claim text.