H05K 2201/10924
Leads formed from a punched metal foil
H05K2201/10924 (Leads formed from a punched metal foil) appears on 183 US grants and 97 published applications in this corpus.
Search patents in H05K- Granted patents
- 183
- Published applications
- 97
- Assignees
- 114
- Inventors
- 369
- Latest grant
- 3 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 4 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 6 | 0 |
| 1987 | 0 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 11 | 0 |
| 1992 | 12 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 4 | 0 |
| 1999 | 7 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 3 |
| 2002 | 6 | 2 |
| 2003 | 3 | 2 |
| 2004 | 2 | 7 |
| 2005 | 7 | 13 |
| 2006 | 2 | 4 |
| 2007 | 7 | 8 |
| 2008 | 2 | 9 |
| 2009 | 7 | 8 |
| 2010 | 7 | 5 |
| 2011 | 2 | 7 |
| 2012 | 4 | 8 |
| 2013 | 4 | 5 |
| 2014 | 5 | 3 |
| 2015 | 4 | 3 |
| 2016 | 3 | 1 |
| 2017 | 4 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
| 2020 | 1 | 2 |
| 2021 | 2 | 2 |
| 2022 | 1 | 3 |
| 2023 | 2 | 0 |
| 2024 | 2 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High speed electrical connector and printed circuit board thereof3 Mar 2026US 12,567,687 B2Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
- Printed circuit board cable clip for signal sensitive applications14 May 2024US 11,984,677 B2West Affum Holdings DAC
- Lead frame, packaged integrated circuit board, power chip, and circuit board packaging method30 Jan 2024US 11,887,918 B2Huawei Technologies Co., Ltd.
- High speed electrical connector and printed circuit board thereof12 Sep 2023US 11,757,215 B2Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
- Semiconductor device17 Jan 2023US 11,557,554 B2Mitsubishi Electric Corporation
- High speed electrical connector and printed circuit board thereof28 Mar 2024US 2024/0106140 A1Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
- Lead frame, packaged integrated circuit board, power chip, and circuit board packaging method14 Jul 2022US 2022/0223506 A1Huawei Technologies Co., Ltd.
- High speed electrical connector and printed circuit board thereof17 Feb 2022US 2022/0052467 A1Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
- Printed circuit board cable clip for signal sensitive applications6 Jan 2022US 2022/0006211 A1West Affum Holdings DAC
- Semiconductor device5 Aug 2021US 2021/0242144 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof247US 4,920,074 AHitachi, Ltd. · 1990
- Through hole mounting of integrated circuit adapter leads194US 5,118,298 AAdvanced Interconnections Corporation · 1992
- Solder mounting of electrical contacts132US 4,767,344 ABurndy Corporation · 1988
- Process of forming a compliant lead frame for array-type semiconductor packages129US 4,751,199 AFairchild Semiconductor Corporation · 1988
- Self regulating temperature heater as an integral part of a printed circuit board90US 5,010,233 AAMP Incorporated · 1991