Semiconductor device

A semiconductor device including a plurality of external electrode terminals to be connected to a mounting target apparatus to which the semiconductor device is to be installed and formed on a rear surface of the semiconductor device, and a semiconductor chip for processing a high frequency signal, the semiconductor device comprising:

• a thick copper member on which the semiconductor chip is mounted;
• a printed circuit board that is disposed on a front surface of the thick copper member and provided with:
• an opening exposing a part of the front surface of the thick copper member,
• a wiring pattern, and
• a conductive via that connects the wiring pattern and the thick copper member;
• a rear-side printed circuit board being another printed circuit board that is disposed on a rear surface of the thick copper member and provided with:
• another wiring pattern,
• another via that is conductive and connects the another wiring pattern, and
• the thick copper member, wherein the another wiring pattern is exposed to a side opposite to another side facing the thick copper member and includes the plurality of the external electrode terminals;
• a conductive connecting member that connects the wiring pattern to the another wiring pattern, the semiconductor chip being mounted on the front surface of the thick copper member exposed through the opening and being connected to the wiring pattern by a metal wire;
• an electronic component that is mounted on a front surface of the printed circuit board opposite to a side facing the thick copper member and connected to the wiring pattern;
• and
• a cap or an epoxy resin that encapsulates or seals the front surface of the printed circuit board opposite to the side facing the thick copper member, the semiconductor chip, the electronic component, and the metal wire.

A semiconductor device including a plurality of external electrode terminals to be connected to a mounting target apparatus to which the semiconductor device is installed and formed on a rear surface of the semiconductor device, and a semiconductor chip for processing a high frequency signal, the semiconductor device comprising:

• a thick copper member in which the plurality of the external electrode terminals are formed, the semiconductor chip being mounted on one of the plurality of the external electrode terminals;
• a printed circuit board that is disposed on a front surface of the thick copper member and provided with:
• an opening exposing a part of the front surface of the thick copper member,
• a wiring pattern, and
• a conductive via connecting the wiring pattern and the thick copper member, the semiconductor chip being mounted on the front surface of the thick copper member exposed through the opening and connected to the wiring pattern by a metal wire;
• an electronic component that is mounted on a front surface of the printed circuit board opposite to a side facing the thick copper member and connected to the wiring pattern;
• and
• a cap or an epoxy resin that encapsulates or seals:
• the front surface of the printed circuit board opposite to the side facing the thick copper member,
• the semiconductor chip,
• the electronic component, and
• the metal wire,
• wherein a height of the wiring pattern formed on the front surface of the printed circuit board opposite to the side facing the thick copper member with respect to the thick copper member as a reference is −10% to +10% of a height of the semiconductor chip with respect to the thick copper member as the reference.

A semiconductor device including a plurality of external electrode terminals to be connected to a mounting target apparatus to which the semiconductor device is installed and formed on a rear surface of the semiconductor device, and a semiconductor chip for processing a high frequency signal, the semiconductor device comprising:

• a thick copper member in which the plurality of the external electrode terminals are formed, the semiconductor chip being mounted on one of the plurality of the external electrode terminals;
• a printed circuit board that is disposed on a front surface of the thick copper member and provided with:
• an opening exposing a part of the front surface of the thick copper member,
• a wiring pattern, and
• a conductive via connecting the wiring pattern and the thick copper member, the semiconductor chip being mounted on the front surface of the thick copper member exposed through the opening and connected to the wiring pattern by a metal wire;
• an electronic component that is mounted on a front surface of the printed circuit board opposite to a side facing the thick copper member and connected to the wiring pattern;
• and
• a cap or an epoxy resin that encapsulates or seals:
• the front surface of the printed circuit board opposite to the side facing the thick copper member,
• the semiconductor chip,
• the electronic component, and
• the metal wire,
• wherein the printed circuit board is a multilayer printed circuit board, the opening of the printed circuit board is formed in a stair case shape to expose a part of the wiring pattern formed inside, and a height of the wiring pattern exposed through the opening with respect to the thick copper member as the reference is −10% to +10% of a height of the semiconductor chip with respect to the thick copper member as the reference.