H05K 2201/10939
Lead of component used as a connector
H05K2201/10939 (Lead of component used as a connector) appears on 20 US grants and 17 published applications in this corpus.
Search patents in H05K- Granted patents
- 20
- Published applications
- 17
- Assignees
- 26
- Inventors
- 48
- Latest grant
- 3 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 1 | 0 |
| 2017 | 0 | 1 |
| 2018 | 1 | 3 |
| 2019 | 3 | 1 |
| 2020 | 0 | 1 |
| 2021 | 0 | 0 |
| 2022 | 1 | 1 |
| 2023 | 2 | 2 |
| 2024 | 0 | 1 |
| 2025 | 1 | 0 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic module3 Mar 2026US 12,568,582 B2Cyntec Co., Ltd.
- High speed grid array module13 Jan 2026US 12,526,969 B2Intel Corporation
- Semiconductor package comprising a cavity with exposed contacts and a semiconductor module23 Dec 2025US 12,506,051 B2Infineon Technologies Austria AG
- Electronic component, voltage regulation module and voltage stabilizer25 Jul 2023US 11,711,893 B2Shennan Circuits Co., Ltd.
- Electronics of an electric motor of a motor vehicle24 Jan 2023US 11,563,355 B2Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Bamberg
- Flexible printed circuit board assembly, battery module including the same and method of manufacturing the flexible printed circuit board assembly16 Apr 2026US 2026/0107376 A1Samsung SDI.Co., Ltd.
- Semiconductor device and method for manufacturing the same19 Mar 2026US 2026/0082946 A1Fuji Electric Co., Ltd.
- Electronic Module8 Feb 2024US 2024/0049391 A1Cyntec Co., Ltd.
- Semiconductor Package Comprising a Cavity with Exposed Contacts and a Semiconductor Module23 Mar 2023US 2023/0093341 A1Infineon Technologies Austria AG
- Electronic component, voltage regulation module and voltage stabilizer5 Jan 2023US 2023/0007776 A1Shennan Circuits Co., Ltd.
Most cited
By later US patents
- Metallized ceramic and printed circuit module53US 4,082,394 AInternational Business Machines Corporation · 1978
- Surface mounted decoupling capacitor22US 4,882,656 A1989
- Method and apparatus for implementing engineering changes for integrated circuit module11US 5,184,284 AInternational Business Machines Corporation · 1993
- Heat dissipation device for an electronic device5US 10,212,816 B2Aptiv Technologies AG · 2019
- Noise dampening energy efficient circuit board and method for constructing and using same5US 8,569,631 B2Tangitek, LLC · 2013