High speed grid array module

A computer system comprising:

• a system board including a system contact layout matching a contact layout of a memory device;
• a circuit board including:
• a first surface including a pad layout matching the contact layout of the memory device, to electrically interconnect to the memory device, wherein the contact layout of the memory device includes a first array of multiple columns of contacts, a second array of multiple columns of contacts, and a space between the first array and the second array without contacts;
• and
• a second surface opposite the first surface, the second surface including a pin layout with columns of pins corresponding to the contact layout of the memory device, and including a column of ground pins in the space between the first array and the second array, the column of ground pins not corresponding to a column of contacts in the contact layout of the memory device, the pin layout to electrically interconnect to the system contact layout.