Surface mounted decoupling capacitor

In combination, a printed circuit board having a series of sockets, including at least one dedicated power socket and at least one dedicated ground socket and a surface mountable decoupling capacitor assembly, said assembly comprising:

• an insulative substrate;
• at least one pair of hollow insertable contacts connected to and extending through said substrate, each pair of said contacts being spaced being spaced from each other a distance representative of a distance between said at least one power socket and said at least one ground socket of said printed circuit board;
• at least one decoupling capacitor mounted on said substrate, each capacitor of said at least one capacitor having internal stacked interdigitated plates and opposed conductive sideplates connecting alternate ones of said stacked plates;
• a conductive pathway on a surface of said substrate extending from each one of said opposed conductive sideplates to one of said hollow insertable contacts of each of said at least one pair of contacts, and
• means connecting said pathways to said conductive sideplate, said assembly being insertable into said printed circuit board under a multi-lead pin integrated circuit package positioned on said printed circuit board or on a wave-solderable surface of said printed circuit board such that only one or more power lead pins and one or more ground lead pins of said integrated circuit package pass into electrical contact with respective ones of said at least one pair of contacts to interconnect with respective ones of said at least one power socket and said at least one ground socket of said printed circuit board, remaining ones of said lead pins being inserted into the remainder of said series of sockets of said printed circuit board without electrical connection with said conductive pathways.