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US 12,568,582 B2Granted
Electronic module
AssigneeCyntec Co., Ltd.
InventorsChien Ming Chen, Da-Jung Chen, Ssu-Lung Hsu
Life of this patent
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Abstract
An electronic module, comprising: a first electronic device, a first circuit board disposed over the first top surface, and a second circuit board disposed under the bottom surface of the body of the first electronic device, wherein a plurality of conductors are disposed over a first lateral surface for electrically connecting the first circuit board and the second circuit board, wherein a plurality of electrodes of the electronic module are disposed on a bottom surface of the second circuit board.
Claims19
An electronic module, comprising:
- a first electronic device, comprising a body having a top surface, a bottom surface, and a plurality of lateral surfaces;
- a first circuit board, disposed over the first top surface, wherein at least one second electronic device is disposed on the first circuit board and electrically connected to the first circuit board;
- and
- a second circuit board, wherein the second circuit board is disposed under the bottom surface of the body of the first electronic device, wherein a plurality of conductors are disposed over a first lateral surface for electrically connecting the first circuit board and the second circuit board, wherein a plurality of electrodes of the electronic module are disposed on a bottom surface of the second circuit board, wherein a first power pin and a second power pin are disposed on a lateral surface of the body, wherein the first power pin and the second power pin are separated by a gap, wherein a metal layer is disposed over the first lateral surface of the body and covers at least one portion of the first power pin, the gap, and at least one portion of the second power pin.
1 more element
An electronic module, comprising:
- a first electronic device, comprising a body having a top surface, a bottom surface, and a plurality of lateral surfaces;
- a first power pin, wherein a first portion of the first power pin is disposed on the top surface of the body and extends to a second portion of the first power pin disposed on the bottom surface of the body via a third portion of the first power pin disposed on a first lateral surface of the body;
- and
- a second power pin, wherein a first portion of the second power pin is disposed on the top surface of the body and extends to a second portion of the second power pin disposed on the bottom surface of the body via a third portion of the second power pin disposed on the first lateral surface of the body;
- a metal layer, disposed over the first lateral surface of the body and covering at least one portion of the first power pin, at least one portion of the second power pin, and a gap between the first power pin and the second power pin.
2 more elements
Dependencies are inferred from the claim text.