Electronic device

An electronic device, comprising:

• a substrate;
• an electronic component disposed under the substrate;
• a circuit structure disposed under the substrate;
• a shielding layer disposed under the substrate and covering the electronic component and connected to the circuit structure, wherein the circuit structure and the shielding layer are collectively configured to shield the electronic component from electromagnetic interference;
• a plurality of first soldering elements disposed on an upper surface of the circuit structure;
• and
• a plurality of second soldering elements disposed on a lower surface of the circuit structure, wherein a quantity of the plurality of first soldering elements is different from a quantity of the plurality of second soldering elements in a cross-sectional view.

An electronic device, comprising:

• an electronic component;
• a circuit structure adjacent to the electronic component and comprising a conductive pad;
• an encapsulant encapsulating the electronic component, wherein the encapsulant and the circuit structure collectively define a step;
• and
• an shielding layer covering the electronic component, wherein a portion of the shielding layer is disposed on the step and connected to the conductive pad,
• wherein the step exposes a dielectric layer of the circuit structure, and the portion of the shielding layer contacts the dielectric layer.