Electronic device including thermal interface material

An electronic device comprising:

• a printed circuit board;
• a first package on the printed circuit board and comprising first circuitry;
• a second package on the first package and comprising second circuitry,
• wherein the first package comprises a first portion and a second portion, the second package being on the first portion;
• a shield can on the printed circuit board around the first package and the second package and having an opening in a top wall thereof;
• a shielding sheet on the shield can and over the opening;
• a first thermal interface material (TIM) on the second portion of the first package and thermally connected to the first package;
• a second TIM on the second package and the first TIM and under the shielding sheet, the second TIM being thermally connected to the first TIM, the second package, and the shielding sheet;
• and
• a heat dissipation member on the shielding sheet and thermally connected to the shielding sheet,
• wherein the first TIM has a first stiffness greater than a second stiffness of the second TIM.