Component Carrier With at Least One Opening and Method of Manufacturing a Component Carrier

Abstract

A component carrier includes at least one electrically insulating layer structure and at least one electrically conductive layer structure. The at least one insulating layer structure has at least one opening which connects a main surface of the at least one electrically insulating layer structure with at least part of the at least one electrically conductive layer structure. The at least one opening is delimited by a lateral wall with two portions, a first portion and a second portion, one above the other in a thickness direction of the at least one insulating layer structure. The two portions have a different extension one to each other in the thickness direction of the at least one insulating layer structure. A method of manufacturing a component carrier is also provided.

Dependencies are inferred from the claim text.