US 12,525,735 B2 · High performance interposer and chip socket having contacts with an outer bean and an inner beam

Abstract

An interposer configured for connecting offset arrays of signal pads on parallel surfaces. Contacts of the interposer have mating portions with multiple beams. One of the beams makes contact with a pad on a first of the surfaces and is deflected when the surfaces are pressed together with the interposer between them. A second of the beams is positioned so that the first beam presses into that second beam as the first beam deflects. The second beam may contact a central location on the first beam. An electrical path through the contact from a pad on the first surface to a pad on the second surface may be shorter when the first beam is pressed into the second beam than through the first beam alone. A shorter path may improve signal integrity. Moreover, the spring force of the contact may be set by the second beam.

Claims20

Dependent claims

A contact for an interposer, the contact comprising:

an intermediate portion elongated in a first direction;
and
a plurality of beams coupled to the intermediate portion,
wherein:
each of the plurality of beams is elongated in a direction transverse to the first direction;
a first beam of the plurality of beams comprises a first contact surface facing in the first direction;
a second beam of the plurality of beams comprises a second contact surface facing in the first direction;
and
the first beam and the second beam are in a plane parallel to the first direction with the second contact surface within the working range of the first beam such that the first beam is adapted to contact the second beam upon deflection of the first beam, and wherein the first and second beams have pivot points offset from one another in the direction transverse to the first direction such that further deflection of the first beam causes the second beam to slide against the first beam.

6 more elements

An interposer comprising:

an insulative member comprising a first surface and a second, opposite surface;
and
a plurality of contacts comprising ends exposed at the first surface and mating portions exposed at the second surface,
wherein:
the mating portion of each of the plurality of contacts comprise a plurality of beams,
a first beam of the plurality of beams comprises a contact surface facing in a first direction perpendicular to the second surface and a second surface of the first beam, facing opposite the contact surface, wherein the first beam is adapted to deflect about a first pivot point;
a second beam of the plurality of beams aligned with the first beam in the first direction and disposed between the first beam and the insulative member;
and
compression of the first beam beyond an amount at which the first beam contacts the second beam causes the second beam to deflect about a second pivot point that is offset from the first pivot point in a second direction perpendicular to the first direction, wherein causing the second beam to deflect about the second pivot point comprises causing the second beam to slide against the first beam.

6 more elements

Dependencies are inferred from the claim text.

High performance interposer and chip socket having contacts with an outer bean and an inner beam

Life of this patent

High performance interposer and chip socket having contacts with an outer bean and an inner beam

Life of this patent

Abstract

Claims20