Adhesive component means for attaching electrical components to conductors
AssigneeMicro-Circuits Company
InventorRobert F. Bradley
Life of this patent
Estimating the term…
Abstract
A surface mounting method which utilizes an adhesive component to mount the electrical components to a printed circuit board instead of solder and which includes the use, between the contacting surfaces, of a flowable, corrosion-resistant material which bridges contact imperfections and penetrates surface films. The method may also be implemented to connect two electrical conductors.
Claims3
In combination, an adhesive member and a contact enhancing material for cold forming an electrical and mechanical connection between an electrical component having a body and conductive lead and a printed circuit board having a conductive pad, said conductive lead of said electrical component contacting conductive pad of said printed circuit board, said contact enhancing material located between said pad and said lead, said adhesive member located between said printed circuit board and said electrical component body to mechanically connect said electrical component to said printed circuit board, said adhesive member being a resilient strip having an adhesive coating on at least one side, said contact enhancing material being a flowable metal-pigmented corrosion resistant material carried by said lead.
Dependencies are inferred from the claim text.