Snap fit bracket for electrolytic capacitors

A semiconductor package, comprising:

• a substrate defining an opening;
• a notch disposed on a first edge of the substrate within the opening;
• a bracket for a capacitor provided within the opening, the bracket comprising:
• a first sidewall;
• a second sidewall;
• a proximal wall extending between a proximal end of the first sidewall and a proximal end of the second sidewall;
• a distal wall extending between a distal end of the first sidewall and a distal end of the second sidewall, the first sidewall, the second sidewall, the proximal wall and the distal wall defining a bracket opening;
• a first flange and a second flange extending from the proximal wall and forming a first channel that is slideably coupled to the first edge of the substrate;
• a third flange and a fourth flange extending from the distal wall and forming a second channel that is slideably coupled to a second edge of the substrate;
• and
• a snap fit fastener disposed within the first channel, the snap fit fastener comprising a cantilever beam having a protrusion extending from a distal end, the protrusion causing the cantilever beam to move from a first position to a second position as the bracket is slideably coupled to the substrate.

A bracket for mounting a capacitor to a substrate, comprising:

• a body defining an opening;
• a first coupling means provided on a proximal end of the body;
• a second coupling means provided on a distal end of the body, the first coupling means and the second coupling means for coupling the bracket to an opening defined by a substrate;
• and
• a fastening means for securing the bracket within the opening defined by the substrate, the fastening means comprising a cantilever beam having a protrusion extending from a distal end, the protrusion causing the cantilever beam to move from a first position to a second position as the bracket is coupled to the opening defined by the substrate.