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US 12,550,265 B2Granted
High capacitance module
AssigneeInnodisk Corporation
InventorChih-Chieh Kao
Life of this patent
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Abstract
A high capacitance module for electrically connecting to a second circuit board comprises a first circuit board provided with a plurality of metal contacts and at least one capacitor core arranged on the first circuit board. The capacitor cores have connection pins that are electrically connected to the metal contacts through conductive glue. An adhesive layer covers the capacitor cores. The capacitor cores are electrically connected to a memory module arranged on the second circuit board.
Claims11
A high capacitance module, adapted to be electrically connected to a second circuit board, the high capacitance module comprising:
- a first circuit board, provided with a plurality of metal contacts;
- at least one capacitor, which does not include a molded housing, a positive lead frame, and a negative lead frame, consisting of a capacitor core and connection pins, wherein the capacitor core is arranged on the first circuit board, and the connection pins are electrically connected to the plurality of metal contacts via a conductive glue;
- and
- an adhesive layer, directly covering all outer surfaces of the capacitor, the connecting pins, and the conductive glue;
- wherein the capacitor core is electrically connected to a memory module arranged on the second circuit board.
2 more elements
Dependencies are inferred from the claim text.