Method and apparatus for bonding components leads to pads located on a non-rigid substrate

A method of bonding a metallic lead to a metallic pad disposed on a non-rigid substrate comprising the steps of:

• disposing the lead in contact with the pad disposed on a non-rigid substrate along a bond surface;
• contacting the lead with a bonding tip;
• applying laser energy to the tip sufficient to heat the tip;
• applying a predetermined static force to the tip in a direction substantially normal to the bond surface for causing the lead and the pad to be in forced intimate contact and for impressing a footprint in the lead;
• applying ultrasonic energy in the tip for causing the tip to undergo reciprocating vibratory motion along an axis substantially parallel to the bond surface while in contact with the lead;
• ceasing applying laser energy and ultrasonic energy and the predetermined static force after a predetermined period of time, and
• analyzing the footprint in the lead for determining bond quality.

A method of joining a component having at least one metallic lead to a non-rigid substrate having at least one metallic pad thereon comprising the steps of:

• (a) disposing a lead in contact with a respective pad disposed on a non-rigid substrate along a bond surface;
• (b) contacting the lead with a bonding tip;
• (c) applying laser energy to the tip sufficient to heat the tip;
• (d) applying a predetermined static force to the tip in a direction substantially normal to the bond surface for causing the lead and the pad to be in forced intimate contact;
• (e) applying ultrasonic energy to the tip for causing the tip to undergo reciprocating vibratory motion along an axis substantially parallel to the bond surface while in contact with the lead;
• and
• (f) ceasing applying laser energy and ultrasonic energy and the predetermined static force after a predetermined period of time when the lead is bonded to the pad.

A method of joining a component having at least one metallic lead to a non-rigid substrate having at least one metallic pad thereon comprising the steps of:

• (a) disposing a lead in contact with a respective pad disposed on a non-rigid substrate along a bond surface;
• (b) contacting the lead with a bonding tip;
• (c) applying laser energy to the tip sufficient to heat the tip;
• (d) applying a predetermined static force to the tip in a direction substantially normal to the bond surface for causing the lead and the pad to be in forced intimate contact and for impressing a footprint in the lead;
• (e) applying ultrasonic energy to the tip for causing the tip to undergo reciprocating vibratory motion along an axis substantially parallel to the bond surface while in contact with the lead;
• (f) ceasing applying laser energy and ultrasonic energy and the predetermined static force after a predetermined period of time, and
• (g) analyzing the footprint in the lead for determining bond quality.

An apparatus for bonding a metallic lead to a metallic pad disposed on a non-rigid substrate comprising:

• support means for supporting a lead superimposed on a pad disposed on a non-rigid substrate;
• an ultrasonic bonder including a tip, the tip having a frontal surface for engaging a lead to be bonded to a pad, said tip having a cavity centrally disposed and extending from said frontal surface, said frontal surface having two crossed grooves intersecting in the region of said cavity;
• laser energy source means coupled to said tip for providing laser energy pulses to said cavity for heating said frontal surface;
• and
• synchronizer means coupled to said support means, said ultrasonic bonder and said laser energy source means for controlling operation of said support means, said ultrasonic bonder and said laser energy source means.

An apparatus for bonding a component having at least one metallic lead to a non-rigid substrate having at least one pad thereon comprising:

• support means for supporting a lead superposed on a respective pad on a non-rigid substrate;
• ultrasonic bonder means including a tip, the tip having a frontal surface for engaging a lead to bonded to a respective pad, said tip having a cavity centrally disposed and extending from said frontal surface, said frontal surface having two crossed grooves intersecting in the region of said cavity;
• laser energy source means coupled to said tip for providing laser energy pulses to said cavity for heating said frontal surface, and
• synchronizer means coupled to said support means, said ultrasonic bonder and said laser energy source means for controlling operation of said support means, said ultrasonic bonder and laser energy source means whereby each lead of a component is bonded to a respective pad on a non-rigid substrate for bonding the component to the non-rigid substrate.

An apparatus for bonding a metallic lead to a metallic pad disposed on a non-rigid substrate comprising:

• support means for supporting a lead superimposed on a pad disposed on a non-rigid substrate;
• an ultrasonic bonder including a tip, the tip having a frontal surface for engaging a lead to be bonded to a pad, said tip having a cavity centrally disposed and extending from said frontal surface;
• laser energy source means coupled to said tip by optical fiber means for providing laser energy pulses to said cavity for heating said frontal surface;
• and
• synchronizer means coupled to said support means, said ultrasonic bonder and said laser energy source means for controlling operation of said support means, said ultrasonic bonder and said laser energy source means.