H05K 2201/10636
Leadless chip
Official title: Leadless chip, e.g. chip capacitor or resistor
H05K2201/10636 (Leadless chip) appears on 1,455 US grants and 1,415 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,455
- Published applications
- 1,415
- Assignees
- 510
- Inventors
- 2,952
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 6 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 9 | 0 |
| 1983 | 3 | 0 |
| 1984 | 7 | 0 |
| 1985 | 6 | 0 |
| 1986 | 11 | 0 |
| 1987 | 12 | 0 |
| 1988 | 7 | 0 |
| 1989 | 17 | 0 |
| 1990 | 14 | 0 |
| 1991 | 10 | 0 |
| 1992 | 14 | 0 |
| 1993 | 7 | 0 |
| 1994 | 17 | 0 |
| 1995 | 18 | 0 |
| 1996 | 20 | 0 |
| 1997 | 15 | 0 |
| 1998 | 24 | 0 |
| 1999 | 17 | 0 |
| 2000 | 27 | 0 |
| 2001 | 40 | 15 |
| 2002 | 36 | 65 |
| 2003 | 49 | 49 |
| 2004 | 48 | 56 |
| 2005 | 36 | 74 |
| 2006 | 39 | 66 |
| 2007 | 54 | 76 |
| 2008 | 35 | 91 |
| 2009 | 35 | 85 |
| 2010 | 55 | 78 |
| 2011 | 73 | 43 |
| 2012 | 58 | 40 |
| 2013 | 32 | 46 |
| 2014 | 42 | 91 |
| 2015 | 64 | 92 |
| 2016 | 58 | 54 |
| 2017 | 59 | 49 |
| 2018 | 54 | 55 |
| 2019 | 72 | 54 |
| 2020 | 64 | 57 |
| 2021 | 42 | 36 |
| 2022 | 33 | 41 |
| 2023 | 35 | 35 |
| 2024 | 35 | 36 |
| 2025 | 25 | 12 |
| 2026 | 13 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structurally enhanced filtering of circuit board planes18 Aug 2026US 12,713,518 B2Microsoft Technology Licensing, LLC
- Direct write dual cure gasket4 Aug 2026US 12,698,410 B2Raytheon Company
- Power module28 Jul 2026US 12,695,023 B2Delta Electronics, Inc.
- Electronic device26 May 2026US 12,641,727 B2Innolux Corporation
- Electronic component mounting structure and method for manufacturing same26 May 2026US 12,641,733 B2Murata Manufacturing Co., Ltd.
- Mounting structure for electronic component17 Sep 2026US 2026/0279663 A1Murata Manufacturing Co., Ltd.
- Electronic device3 Sep 2026US 2026/0262169 A1Innolux Corporation
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
- Method for producing electronic component and method for producing mount structure6 Aug 2026US 2026/0229412 A1Murata Manufacturing Co., Ltd.
- Mounting structure of multilayer electronic component23 Jul 2026US 2026/0214804 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Low-cost accelerometer370US 6,336,365 B12002
- Flexible printed circuit sensor assembly for detecting optical pulses256US 5,390,670 AGould Electronics Inc. · 1995
- Surface mount multilayer capacitor225US 5,880,925 AAVX Corporation · 1999
- Method of making a flexible printed circuit sensor assembly for detecting optical pulses200US 5,263,244 AGould Inc. · 1993
- Stacked packages151US 6,977,440 B2Tessera, Inc. · 2005