Mounting structure for electronic component

A mounting configuration of an electronic component, comprising:

• a pair of lands on a substrate;
• an electronic component including a component main body and a pair of external electrodes, each external electrode having an extension portion;
• and
• solder connecting the external electrodes to the lands;
• wherein at least a portion of each extension portion is in direct contact with a surface of a corresponding land without the solder being interposed therebetween, the direct contact forming a solder-free zone between the portion of each extension portion and the land surface.

A mounting configuration for an electronic component, comprising:

• a pair of lands disposed on a substrate;
• an electronic component including a component main body and a pair of external electrodes, each of the pair of external electrodes having an extension portion;
• and
• solder electrically connecting the pair of external electrodes to the pair of lands;
• wherein, when a direction in which the pair of lands are aligned is defined as an X direction, a direction in which the pair of lands are spaced apart is defined as a spacing direction, and a direction in which the pair of lands are opposed to each other is defined as an opposing direction,
• each land of the pair of lands includes a land upper end portion located further in the spacing direction than an extension portion end portion of a corresponding extension portion;
• and
• wherein an opposing direction end portion of the solder is set back in the spacing direction from a boundary portion between the extension portion and the component main body.