Electronic component mounting structure and method for manufacturing same

An electronic component mounting structure comprising:

• a circuit board having a first electrode, the first electrode being provided on a surface of the circuit board and containing Cu as a main component;
• and
• an electronic component mounted on the circuit board and having a second electrode, the second electrode being provided on a surface of the electronic component;
• wherein the second electrode includes a first plating containing Ni as a main component and a second plating containing Sn as a main component, the second plating being formed on a surface of the first plating, and
• an intermediate bonding layer is provided between the first plating and the first electrode, and
• the intermediate bonding layer includes a first region containing an alloy of Cu and Sn as a main component and a second region containing Sn as a main component.