US 2026/0262169 A1 · ELECTRONIC DEVICE

Abstract

An electronic device includes a circuit substrate, an electronic element, and a connection layer. The circuit substrate includes a plurality of first bonding pads. The electronic element includes a plurality of second bonding pads. The connection layer is disposed between one of the first bonding pads and one of the second bonding pads. Within a projection region of the one of the second bonding pads onto the circuit substrate, a first distance is between of the one of the second bonding pads and the one of the first bonding pads in a first region along a normal direction of the circuit substrate, a second distance is between of the one of the second bonding pads and the one of the first bonding pads in a second region along the normal direction of the circuit substrate, and the first distance is different from the second distance.

Claims8

Dependent claims

An electronic device, comprising:

a circuit substrate, comprising a plurality of first bonding pads;
an electronic element, comprising a plurality of second bonding pads;
and
a connection layer, disposed between one of the plurality of first bonding pads and one of the plurality of second bonding pads,
wherein within a projection region of the one of the plurality of second bonding pads onto the circuit substrate, a first distance is between of the one of the plurality of second bonding pads and the one of the plurality of first bonding pads in a first region along a normal direction of the circuit substrate, a second distance is between of the one of the plurality of second bonding pads and the one of the plurality of first bonding pads in a second region along the normal direction of the circuit substrate, and the first distance is different from the second distance.

2 more elements

Dependencies are inferred from the claim text.

Electronic device

Life of this patent

Electronic device

Life of this patent

Abstract

Claims8