Electronic device

An electronic device, comprising:

• a circuit substrate, comprising a plurality of first bonding pads;
• an electronic element, comprising a plurality of second bonding pads;
• and
• a connection layer, provided between one of the plurality of first bonding pads and one of the plurality of second bonding pads,
• wherein the connection layer comprises a first portion, a second portion, and a third portion, the second portion is connected between the first portion and the third portion, the second portion is defined as a portion of the connection layer that overlaps with a projection region of the second bonding pad onto the circuit substrate, the first portion is defined as a portion away from another first bonding pad of the plurality of first bonding pads that does not overlap with the projection region, and the third portion is defined as a portion which is adjacent to the another first bonding pad of the plurality of first bonding pads and does not overlap with the projection region, wherein a maximum width of the first portion is different from a maximum width of the third portion in a direction perpendicular to a normal direction of the circuit substrate;
• wherein the connection layer has a first side and a second side opposite to each other, a length of the first side of the connection layer is different from a length of the second side;
• and
• wherein the one of the plurality of first bonding pads has a first upper surface, on a cross-section, a first included angle is provided between an extension line of the first side and the first upper surface, a second included angle is provided between an extension line of the second side and the first upper surface, and the first included angle is different from the second included angle.