H05K 2201/10659
Different types of terminals for the same component
Official title: Different types of terminals for the same component, e.g. solder balls combined with leads
H05K2201/10659 (Different types of terminals for the same component) appears on 152 US grants and 101 published applications in this corpus.
Search patents in H05K- Granted patents
- 152
- Published applications
- 101
- Assignees
- 96
- Inventors
- 291
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 7 | 0 |
| 1993 | 2 | 0 |
| 1994 | 7 | 0 |
| 1995 | 6 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 4 | 0 |
| 1999 | 8 | 0 |
| 2000 | 9 | 0 |
| 2001 | 7 | 1 |
| 2002 | 5 | 6 |
| 2003 | 6 | 12 |
| 2004 | 5 | 6 |
| 2005 | 8 | 6 |
| 2006 | 2 | 8 |
| 2007 | 7 | 6 |
| 2008 | 2 | 8 |
| 2009 | 2 | 6 |
| 2010 | 5 | 9 |
| 2011 | 5 | 7 |
| 2012 | 6 | 2 |
| 2013 | 0 | 0 |
| 2014 | 2 | 2 |
| 2015 | 1 | 3 |
| 2016 | 2 | 0 |
| 2017 | 0 | 3 |
| 2018 | 1 | 0 |
| 2019 | 2 | 4 |
| 2020 | 4 | 1 |
| 2021 | 1 | 4 |
| 2022 | 4 | 1 |
| 2023 | 0 | 3 |
| 2024 | 1 | 3 |
| 2025 | 1 | 0 |
| 2026 | 4 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board assembly21 Jul 2026US 12,690,125 B2Mettler-Toledo AG
- Substrate structure connected on basis of solder ball and elastic body7 Jul 2026US 12,677,371 B2Samsung Electronics Co., Ltd.
- Printed circuit board, battery module, battery pack, and electrical device5 May 2026US 12,620,635 B2Contemporary Amperex Technology (Hong Kong) Limited
- Storage device including configurable printed circuit board10 Feb 2026US 12,550,253 B2Samsung Electronics Co., Ltd.
- Semiconductor package comprising a cavity with exposed contacts and a semiconductor module23 Dec 2025US 12,506,051 B2Infineon Technologies Austria AG
- Printed circuit board assembly28 Nov 2024US 2024/0397614 A1Mettler-Toledo AG
- Circuit board and chip package comprising same8 Aug 2024US 2024/0268031 A1LG Innotek Co., Ltd.
- Substrate structure connected on basis of solder ball and elastic body2 May 2024US 2024/0147619 A1Samsung Electronics Co., Ltd.
- Storage device including configurable printed circuit board7 Sep 2023US 2023/0284378 A1Samsung Electronics Co., Ltd.
- Printed circuit board, battery module, battery pack, and electrical device29 Jun 2023US 2023/0207897 A1Contemporary Amperex Technology Co., Limited
Most cited
By later US patents
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Leaded semiconductor device having accessible power supply pad terminals251US 5,508,556 AMotorola, Inc. · 1996
- Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer201US 5,673,479 ALSI Logic Corporation · 1997
- Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array120US 5,490,040 AInternational Business Machines Corporation · 1996
- Semiconductor device with surface mount package adapted for vertical mounting98US 5,451,815 AFujitsu Limited · 1995