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US 2023/0207897 A1Published application
Printed circuit board, battery module, battery pack, and electrical device
AssigneeContemporary Amperex Technology Co., Limited
InventorsXin LI, Zhaohang SHI
Life of this patent
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Abstract
This application discloses a printed circuit board, a battery module, a battery pack, and an electrical device. The printed circuit board may include: a substrate, a pad, a solder paste layer, a component body, and a support assembly. The pad may be disposed above the substrate. The solder paste layer may be disposed above the pad. The component body may be disposed above the solder paste layer. The support assembly may be disposed between the pad and the component body to form a degassing space between the component body and the solder paste layer.
Claims20
A printed circuit board, comprising:
- a substrate;
- a pad above the substrate;
- a solder paste layer above the pad;
- a component body above the solder paste layer;
- and
- a support assembly between the pad and the component body to form a degassing space between the component body and the solder paste layer.
3 more elements
Dependencies are inferred from the claim text.