Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array

A packaged electronic hardware unit having a footprint including an array of electrical connections for engagement with a circuit board for performing logic functions without incurring mechanical stress which can result in electrical discontinuity at the electrical connections, comprising:

• a substrate having a center and a planar underside surface;
• an electrical logic circuit have input/output terminals carried by the substrate;
• individual contacts of controlled collapse electrically conductive solder material connected to some of the input/output terminals formed in the shape of balls extending downwardly from the substrate and extending in an orthogonal direction from the planar underside surface of the substrate;
• and
• individual pins of electrically conductive material connected to other of the input/output terminals not connected to the contacts, extending downwardly from the substrate and orthogonally from the substantially planar underside surface of the substrate and disposed more outwardly from the center of the substrate than any contact to form an array of electrical connections including contacts and pins, which contacts include a maximum number of contacts forming a circular array of contacts, and which pins are disposed farther from the center of the substrate than the contacts to provide electrical connections which do not incur mechanical stress which can result in electrical discontinuity at the electrical connections.