Semiconductor device with surface mount package adapted for vertical mounting

A semiconductor device comprising:

• a semiconductor element;
• a stage having a side and a first edge, the stage supporting the semiconductor element on the side thereof and the semiconductor element thereby being vertically oriented relatively to, and disposed above, a horizontally oriented circuit board;
• a stacked layer structure having a plurality of wiring boards and a plate layer arranged in a stacked formation and having a second edge, the stacked layer structure being supported on the side of the stage adjacent the semiconductor element and each of the wiring boards comprising plural wiring lines making corresponding, plural external connections with the semiconductor element;
• and
• first supporting members extending, in spaced relationship, from the first edge of the stage and second supporting members extending, in spaced relationship, from the second edge of the stacked layer structure, the first and second supporting members extending toward the circuit board and having respective first and second portions extending in respective, different first and second directions parallel to the surface of and contacting the circuit board thereby to support the stage with the semiconductor element and the stacked layer structure in the vertically oriented position thereof above the circuit board.

A semiconductor device having first and second parallel main surfaces of a common, generally rectangular configuration of length and height dimensions substantially greater than a thickness dimension between the first and second parallel main surfaces, comprising:

• a stage of said generally rectangular configuration and having a semiconductor element mounting position thereon;
• a stacked layer structure comprising a plurality of wiring boards, each of said plurality of wiring boards having said generally rectangular configuration, and said plurality of wiring boards being arranged in parallel and stacked relationship, said stacked layer structure further having a plate layer of said generally rectangular configuration, said stacked layer structure defining a central window therein and being secured to the stage with the window disposed in surrounding relationship relative to the semiconductor element mounting position of the stage;
• said stage further comprising respective first supporting members extending from opposite end portions of the first edge of the stage and the first supporting members including corresponding, first terminal portions extending transversely to the parallel main surfaces;
• and
• said stacked layer structure further comprising respective second supporting members extending from opposite end portions of the second edge of the stacked layer structure and the second supporting members including corresponding, second terminal portions extending transversely to the parallel main surfaces.