H05K 2201/10727
Leadless chip carrier [lcc]
Official title: Leadless chip carrier [LCC], e.g. chip-modules for cards
H05K2201/10727 (Leadless chip carrier [lcc]) appears on 415 US grants and 313 published applications in this corpus.
Search patents in H05K- Granted patents
- 415
- Published applications
- 313
- Assignees
- 220
- Inventors
- 867
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 10 | 0 |
| 1984 | 1 | 0 |
| 1985 | 15 | 0 |
| 1986 | 7 | 0 |
| 1987 | 24 | 0 |
| 1988 | 17 | 0 |
| 1989 | 12 | 0 |
| 1990 | 8 | 0 |
| 1991 | 9 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 10 | 0 |
| 1998 | 5 | 0 |
| 1999 | 13 | 0 |
| 2000 | 10 | 0 |
| 2001 | 13 | 1 |
| 2002 | 13 | 14 |
| 2003 | 10 | 17 |
| 2004 | 11 | 20 |
| 2005 | 13 | 20 |
| 2006 | 9 | 32 |
| 2007 | 8 | 37 |
| 2008 | 17 | 37 |
| 2009 | 20 | 39 |
| 2010 | 19 | 24 |
| 2011 | 24 | 6 |
| 2012 | 24 | 8 |
| 2013 | 14 | 3 |
| 2014 | 11 | 8 |
| 2015 | 2 | 7 |
| 2016 | 5 | 7 |
| 2017 | 9 | 2 |
| 2018 | 3 | 4 |
| 2019 | 5 | 2 |
| 2020 | 1 | 3 |
| 2021 | 3 | 4 |
| 2022 | 1 | 3 |
| 2023 | 2 | 8 |
| 2024 | 3 | 2 |
| 2025 | 5 | 2 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display module and electronic device including the same12 May 2026US 12,628,278 B2Samsung Electronics Co., Ltd.
- Electronic circuit assemblies, methods of manufacturing the same, and modules28 Apr 2026US 12,615,719 B2Pragmatic Semiconductor Limited
- Package, method for forming a package, chip card, and method for forming a chip card24 Mar 2026US 12,588,150 B2Infineon Technologies AG
- Module and component9 Dec 2025US 12,495,485 B2Murata Manufacturing Co., Ltd.
- Electronic module and apparatus25 Nov 2025US 12,484,152 B2Canon Kabushiki Kaisha
- Circuit board6 Aug 2026US 2026/0231325 A1
- Electrical conductor device and method for manufacturing an electrical conductor device25 Jun 2026US 2026/0182472 A1
- Electronic module and apparatus26 Feb 2026US 2026/0059667 A1Canon Kabushiki Kaisha
- Transparent package for use with printed circuit boards19 Jun 2025US 2025/0203772 A1Honeywell Federal Manufacturing & Technologies, LLC
- Electrical circuit formation method, and electrical circuit formation device1 May 2025US 2025/0142734 A1Fuji Corporation
Most cited
By later US patents
- Methods for assembling multiple semiconductor devices202US 7,198,980 B2Micron Technology, Inc. · 2007
- Chip carrier mounting device187US 4,705,205 ARaychem Corporation · 1987
- Method and apparatus for fabricating semiconductor device172US 6,159,770 AFujitsu Limited · 2000
- Device having resin package with projections160US 6,072,239 AFujitsu Limited · 2000
- Chip mounting device154US 4,664,309 ARaychem Corporation · 1987