Electrical circuit formation method, and electrical circuit formation device
AssigneeFuji Corporation
InventorKenji TSUKADA
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Abstract
An electrical circuit formation method including a wiring forming step of forming a metal wiring on a resin layer, an applying step of applying a conductive fluid on the metal wiring, a mounting step of mounting an electronic component such that an electrode comes into contact with the conductive fluid applied in the applying step, and a coating body forming step of forming a coating body with a curable resin to cover a periphery of the electronic component mounted in the mounting step, in which in the applying step, the conductive fluid is applied continuously in a direction in which the metal wiring extends, from a planned mounting position of the electrode to a position that extends out of an outer edge of the electronic component.
Claims5
An electrical circuit formation method comprising:
- a wiring forming step of forming a metal wiring on a resin layer;
- an applying step of applying a conductive fluid on the metal wiring;
- a mounting step of mounting an electronic component such that an electrode comes into contact with the conductive fluid applied in the applying step;
- and
- a coating body forming step of forming a coating body with a curable resin to cover a periphery of the electronic component mounted in the mounting step,
- wherein
- in the applying step, the conductive fluid is applied continuously in a direction in which the metal wiring extends, from a planned mounting position of the electrode to a position that extends out of an outer edge of the electronic component.
An electrical circuit formation device comprising:
- a wiring formation device configured to form a metal wiring on a resin layer;
- a fluid applying device configured to apply a conductive fluid on the metal wiring;
- a mounting device configured to mount an electronic component such that an electrode comes into contact with the conductive fluid applied by the fluid applying device;
- and
- a resin applying device configured to apply a curable resin to cover a periphery of the electronic component mounted by the mounting device,
- wherein
- the fluid applying device is configured to apply the conductive fluid continuously in a direction in which the metal wiring extends, from a planned mounting position of the electrode to a position that extends out of an outer edge of the electronic component.
Dependencies are inferred from the claim text.