Package, method for forming a package, chip card, and method for forming a chip card

A method for forming a package, the method comprising:

• forming an electronic leadless module having a top surface, a bottom surface, and side surfaces between the top surface and the bottom surface, an electronic circuit, a plurality of electrical contact pads at the bottom surface of the electronic leadless module which are electrically conductively coupled to the electronic circuit, and encapsulation material which partially encapsulates the electronic circuit, wherein the electrical contact pads are at least partially free from encapsulation material;
• contouring at least one of the side surfaces of the electronic leadless module to form an anchoring region configured to receive filler material for fastening the electronic leadless module to a carrier frame;
• arranging the electronic leadless module in an opening in a carrier frame with the bottom surface of the electronic leadless module facing the carrier frame;
• and
• arranging filler material in the anchoring region to fasten the electronic leadless module to the carrier frame.