H05K 2201/10643
Disc shaped leadless component
H05K2201/10643 (Disc shaped leadless component) appears on 67 US grants and 44 published applications in this corpus.
Search patents in H05K- Granted patents
- 67
- Published applications
- 44
- Assignees
- 47
- Inventors
- 130
- Latest grant
- 12 Nov 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 5 | 1 |
| 2002 | 1 | 4 |
| 2003 | 5 | 2 |
| 2004 | 3 | 4 |
| 2005 | 2 | 3 |
| 2006 | 2 | 2 |
| 2007 | 2 | 1 |
| 2008 | 3 | 1 |
| 2009 | 2 | 5 |
| 2010 | 3 | 4 |
| 2011 | 1 | 5 |
| 2012 | 5 | 3 |
| 2013 | 2 | 1 |
| 2014 | 2 | 1 |
| 2015 | 2 | 1 |
| 2016 | 2 | 3 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 1 |
| 2024 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Electronic device including coin-cell battery12 Nov 2024US 12,144,123 B2Samsung Electronics Co., Ltd.
- Holder for a button cell, arrangement comprising a holder, and method for automatically mounting a holder13 Feb 2024US 11,903,131 B2WüRth Elektronik Eisos GmbH & Co.KG
- Printed circuit board with embedded sensor28 Jan 2020US 10,542,917 B2Battelle Memorial Institute
- Chip capacitors22 Aug 2017US 9,743,530 B2Texas Instruments Incorporated
- Composite substrate for light emitting diodes22 Nov 2016US 9,502,620 B2Xenio Corporation
- Electronic package and method for forming the same21 Mar 2024US 2024/0098907 A1JCET STATS ChipPAC Korea Limited
- Electronic device including coin-cell battery6 Apr 2023US 2023/0109385 A1Samsung Electronics Co., Ltd.
- Holder for a Button Cell, Arrangement Comprising a Holder, and Method for Automatically Mounting a Holder16 Jun 2022US 2022/0192025 A1WüRth Elektronik Eisos GmbH & Co.KG
- Printed Circuit Board with Embedded Sensor1 Dec 2016US 2016/0345875 A1Battelle Memorial Institute
- Composite Substrate for Light Emitting Diodes23 Jun 2016US 2016/0181480 A1Bridgelux, Inc.
Most cited
By later US patents
- Multilayer ceramic capacitor for three-dimensional mounting119US 6,292,351 B1TDK Corporation · 2001
- Electrical circuit package for greeting cards83US 4,611,262 AAMP Incorporated · 1986
- Electrical devices70US 5,852,397 ARaychem Corporation · 1998
- Self aligning electrical component62US 5,898,574 A1999
- Electronic package having a flexible substrate with ends connected to one another48US 6,841,855 B2Intel Corporation · 2005