Electronic package having a flexible substrate with ends connected to one another
AssigneeIntel Corporation
InventorsEdward W. Jaeck, Chia-Pin Chiu
Life of this patent
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Abstract
An electronic package is provided, having a flexible substrate, a first plurality of conductors, and a second plurality of conductors. The flexible substrate has first and second portions with a fold portion between the first and second portions, and is folded at the fold portion to position the second portion over the first portion. Each one of the first plurality of conductors runs from the first portion over the fold portion onto the second portion. Each one of the second plurality of conductors runs from the first portion onto the second portion without running over the fold portion.
Claims22
An electronic package, comprising:
- a flexible substrate having first and second portions with a fold portion between the first and second portions, the flexible substrate being folded at the fold portion to position the second portion over the first portion;
- a first plurality of conductors, each running from the first portion over the fold portion onto the second portion;
- and
- a second plurality of conductors, each running from the first portion onto the second portion without running over the fold portion.
An electronic package, comprising:
- a flexible substrate having first and second portions with a fold portion between the first and second portions, the flexible substrate being folded at the fold portion to position the second portion over the first portion;
- a plurality of external terminals on the first portion;
- a plurality of external terminals on the second portion;
- a first plurality of conductors, each running from a respective external terminal on the first portion to the left along the first portion, over the fold line and subsequently to the right along the second portion to a respective one of the external terminals on the second portion;
- and
- a second plurality of conductors, each running from a respective external terminal on the first portion to the right along the first portion and subsequently to the left over the second portion without running over the fold portion.
A method of constructing an electronic package, comprising:
- forming a plurality of first conductors and first and second sections of second conductors on a substrate, the first conductors extending from a first portion on a right-hand side of the substrate over a fold portion to a second portion on a left-hand side of the substrate, the first sections on the first portion and the second sections on the second portion;
- folding the substrate at the fold region;
- and
- connecting the first and second sections of the second conductors to one another after the substrate is folded at the fold region.
Dependencies are inferred from the claim text.