H05K 2201/10696
Single-in-line [sil] package
Official title: Single-in-line [SIL] package
H05K2201/10696 (Single-in-line [sil] package) appears on 62 US grants and 22 published applications in this corpus.
Search patents in H05K- Granted patents
- 62
- Published applications
- 22
- Assignees
- 23
- Inventors
- 65
- Latest grant
- 3 May 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 6 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 2 |
| 2002 | 2 | 4 |
| 2003 | 5 | 7 |
| 2004 | 2 | 0 |
| 2005 | 5 | 0 |
| 2006 | 2 | 5 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 2 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 2 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Circuit module3 May 2022US 11,322,429 B2Murata Manufacturing Co., Ltd.
- Semiconductor apparatus28 Dec 2021US 11,212,908 B2Mitsubishi Electric Corporation
- Methods for securing packaged semiconductor devices to carrier substrates4 Aug 2009US 7,569,418 B2Micron Technology, Inc.
- Method of fabricating a vertically mountable IC package24 Feb 2009US 7,494,920 B2Honeywell International Inc.
- Methods for modifying a vertical surface mount package1 Aug 2006US 7,082,681 B2Micron Technology, Inc.
- Semiconductor apparatus18 Jun 2020US 2020/0196432 A1Mitsubishi Electric Corporation
- Circuit module14 May 2020US 2020/0152552 A1Murata Manufacturing Co., Ltd.
- Assemblable substrate for in-line package and assembly with same30 Oct 2008US 2008/0266826 A1Hon Hai Precision Industry Co., Ltd.
- Method of fabricating a vertically mountable IC package26 Apr 2007US 2007/0090529 A1Honeywell International Inc.
- Electrical device allowing for increased device densities14 Sep 2006US 2006/0201705 A1Micron Technology, Inc.
Most cited
By later US patents
- Integrated circuit package including lead frame with electrically isolated alignment feature184US 6,246,108 B1Micron Technology, Inc. · 2001
- Integrated circuit package alignment feature169US 6,048,744 AMicron Technology, Inc. · 2000
- Semiconductor package having interlocking heat sinks and method of fabrication106US 6,075,288 AMicron Technology, Inc. · 2000
- Semiconductor device with surface mount package adapted for vertical mounting98US 5,451,815 AFujitsu Limited · 1995
- Edge-mounted, surface-mount package for semiconductor integrated circuit devices78US 4,975,763 ATexas Instruments Incorporated · 1990