Edge-mounted, surface-mount package for semiconductor integrated circuit devices
AssigneeTexas Instruments Incorporated
InventorsDaniel A. Baudouin, Ernest J. Russell
Life of this patent
Estimating the term…
Abstract
A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.
Claims16
A flat, edge-mounted, surface-mount semiconductor integrated circuit device or the like, comprising:
- a relatively flat package encapsulating a semiconductor chip, said chip having a plurality of bonding pads along at least one edge,
- a plurality of conductive leads extending from at least one edge of said package, the leads being electrically connected to said bonding pads,
- and a plurality of studs integral with said package extending from said at least one edge of said package, said studs being shaped to fit into holes in a printed circuit board for mechanically positioning and supporting the package when said leads are soldered to the printed circuit board.
A plastic frame and package combination for use in the manufacture of semiconductor devices, comprising
- a flat plastic package containing a semiconductor chip,
- a plastic frame surrounding said package but spaced therefrom, generally coplanar with said package,
- a plurality of conductive leads extending from one edge of said package and through one side of said frame,
- and a plurality of studs composed of nonconductive material integral with said package extending from said one edge of said package.
A flat, plastic-encapsulated, edge-mounted, surface-mount semiconductor integrated circuit device or the like, comprising:
- a relatively flat plastic package encapsulating a semiconductor chip, said chip having a plurality of bonding pads along at least one edge,
- a plurality of conductive leads extending from at least one edge of said package, each of said leads being electrically connected to one of said bonding pads,
- and a plurality of non-conductive plastic studs integral with said package extending from said at least one edge of said package, said studs being shaped to fit into holes in a printed circuit board for mechanically positioning and supporting the package when said leads are soldered to the printed circuit board.
Dependencies are inferred from the claim text.